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Dual-Die – 2 in 1 Integration Package Technique

A brand new concept, convenient for customer layout design and the component placement.

The dual-die package is an optimized design for multiple circuit applications providing high current, high efficiency, and high frequency capability in a single package. A variety of chip combinations such as N + P, N + N or P + P...etc, with the small form factor makes the device ideal for space constrained application in load protection switches as well as synchronous converter applications.

Select device for your application

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