Product News
2018-11-22
Dual-Die – 2 in 1 Integration Package Technique
A brand new concept, convenient for customer layout design and the component placement.
The dual-die package is an optimized design for multiple circuit applications providing high current, high efficiency, and high frequency capability in a single package. A variety of chip combinations such as N + P, N + N or P + P...etc, with the small form factor makes the device ideal for space constrained application in load protection switches as well as synchronous converter applications.
Select device for your application
Niko Semiconductor Co.,Ltd.
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ADD：12F., No. 368, Gong-Jian Rd., Shi-Ji Dist., New Taipei City 22161, TAIWAN (R.O.C.)
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